JPH0423328Y2 - - Google Patents

Info

Publication number
JPH0423328Y2
JPH0423328Y2 JP1983183774U JP18377483U JPH0423328Y2 JP H0423328 Y2 JPH0423328 Y2 JP H0423328Y2 JP 1983183774 U JP1983183774 U JP 1983183774U JP 18377483 U JP18377483 U JP 18377483U JP H0423328 Y2 JPH0423328 Y2 JP H0423328Y2
Authority
JP
Japan
Prior art keywords
transistor
microwave
chassis
microwave transistor
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983183774U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6092829U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983183774U priority Critical patent/JPS6092829U/ja
Priority to US06/674,591 priority patent/US4612566A/en
Publication of JPS6092829U publication Critical patent/JPS6092829U/ja
Application granted granted Critical
Publication of JPH0423328Y2 publication Critical patent/JPH0423328Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
JP1983183774U 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体 Granted JPS6092829U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1983183774U JPS6092829U (ja) 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体
US06/674,591 US4612566A (en) 1983-11-30 1984-11-26 Microwave transistor mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983183774U JPS6092829U (ja) 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体

Publications (2)

Publication Number Publication Date
JPS6092829U JPS6092829U (ja) 1985-06-25
JPH0423328Y2 true JPH0423328Y2 (en]) 1992-05-29

Family

ID=16141712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983183774U Granted JPS6092829U (ja) 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体

Country Status (2)

Country Link
US (1) US4612566A (en])
JP (1) JPS6092829U (en])

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713730A (en) * 1985-10-07 1987-12-15 Rockwell International Corporation Microwave plug-in signal amplifying module solderment apparatus
US5182631A (en) * 1988-04-15 1993-01-26 Nippon Telegraph And Telephone Corporation Film carrier for RF IC
US4967258A (en) * 1989-03-02 1990-10-30 Ball Corporation Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same
EP0393584B1 (en) * 1989-04-17 1994-07-13 Matsushita Electric Industrial Co., Ltd. High frequency semiconductor device
US5297007A (en) * 1990-09-19 1994-03-22 Rockwell International Corporation E/M shielded RF circuit board
JP2001185655A (ja) * 1999-12-27 2001-07-06 Mitsubishi Electric Corp マイクロ波回路
US7355854B2 (en) * 2006-06-07 2008-04-08 Harris Corporation Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards
JP4982596B2 (ja) * 2009-09-08 2012-07-25 株式会社東芝 モジュールの接続構造

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3021461A (en) * 1958-09-10 1962-02-13 Gen Electric Semiconductor device
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
JPS482058U (en]) * 1971-05-27 1973-01-11
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
JPS5811746B2 (ja) * 1976-10-27 1983-03-04 日本電気株式会社 超高周波トランジスタ増幅器
JPS5386576A (en) * 1977-01-10 1978-07-31 Nec Corp Package for semiconductor element
JPS55159571A (en) * 1979-05-24 1980-12-11 Yuasa Battery Co Ltd Lead-acid battery
JPS57115852A (en) * 1981-01-10 1982-07-19 Mitsubishi Electric Corp Microwave transistor mount
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
US4455537A (en) * 1981-07-06 1984-06-19 Rca Corporation Microwave circuit interconnect system
US4538124A (en) * 1984-02-10 1985-08-27 Rca Corporation Planar microwave circuit component mounting system

Also Published As

Publication number Publication date
US4612566A (en) 1986-09-16
JPS6092829U (ja) 1985-06-25

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